By Andrew E. Perkins, Suresh K. Sitaraman
Solder Joint Reliability Prediction for a number of Environments offers engineers, graduate scholars, educational researchers, and reliability specialists with insights and necessary instruments for comparing solder joint reliability of ceramic sector array digital programs less than a number of environments. the fabric provided here's now not constrained to ceramic sector array programs in simple terms, it could possibly even be used as a strategy for concerning numerical simulations and experimental information into an easy-to-use equation that captures the fundamental details had to expect solder joint reliability. this type of technique is usually had to relate complicated info in an easy demeanour to managers and non-experts in solder joint who paintings with computing device server functions in addition to for harsh environments resembling these present in the security, area, and car industries.
Drawing upon years of functional adventure and utilizing various examples and illustrative purposes, Andrew Perkins and Suresh Sitaraman disguise state-of-the-art applied sciences in solder joint reliability, including:
A complete precis of present literature on lead-containing ceramic zone array digital package deal solder becoming a member of reliability,
Useful and easy-to-use instruments for predicting solder joint fatigue lifestyles lower than thermal biking, and gear biking enviroments,
New perception into solder joint reliability trying out less than a number of environments, together with vibration environments,
A method for predicting solder joint reliability utilizing numerical simulations and experimental info less than a number of environments that may be concerning any package deal type.
Solder Joint Reliability Prediction for a number of Environments is a must-have e-book for practitioners and researchers who focus on solder.